MCU Products

Platform: BH66F2455 (3.0V) AFE + HT32F67595 (BLE MCU) Release date: 2026-06-08

This document is the user guide for the BestHealth CGM (Continuous Glucose Monitoring) Demo board and associated software resources, based on the BH66F2455 (3.0V) AFE + HT32F67595 (BLE MCU) platform, for customer development and reference.

Project root/
├── 1.doc/                    # Documentation and reference materials
├── 2.Code_AFE/               # AFE (Analog Front End) firmware and drivers
├── 2.Code_Ble/               # BLE (Bluetooth) firmware and protocol stack
├── 3.board/                  # Board and PCB materials
└── README-pub.md / README-pub_EN.md

Contains product descriptions, protocols, chip manuals, and development tool instructions.

Recommendation: Read the Demo board user manual and CGM_BLE协议.pdf before development, then refer to relevant datasheets and programming guides.

The AFE uses BH66F2455 (3.0V platform) for analog signal acquisition (voltage, temperature resistance, WE1/WE2 current) and communicates with the BLE MCU (HT32F67595) or host via UART. BH66F2455_Driver/ contains the full BH66F2455 application project, low-level drivers, and example code.

2.Code_AFE/
└── BH66F2455_Driver/
    ├── application/              # Application layer (e.g. IAP / ISP)
    ├── application_projects/     # CGM application project (programmed into AFE)
    ├── board/                    # Board configuration
    ├── driver/                   # Low-level drivers
    ├── example/                  # Example projects (ADC, NTC, current, UART, timer, ...)
    └── application_projects/doc/ # AFE communication protocol

• Interface: UART
• Settings: 38400 bps, 8N1, no parity
• Data: Little-endian; request–response; inter-frame gap recommended > 50 ms
• Frame format: Header(1) + Length(1) + Command(1) + Data(9) + LRC(1), total 0x0D

Common command codes:

Full frame format, byte definitions, and examples: 2.Code_AFE/BH66F2455_Driver/application_projects/doc/BH66F2452_55_CGM_AFE通信协议.md

• Projects use Holtek format (.pjtx / .OPT); open and build with the official Holtek IDE (HT-IDE / HT32-IDE). The latest IDE already bundles the corresponding MCU CFG — no extra patch needed.
• For programming details, refer to Holtek's BH66F2455 programming guide and the AFE-related documents under 1.doc.

The BLE side uses HT32F67595 with a BLE 5.1 stack, communicates with phone/APP, and talks to the AFE over UART to complete the CGM link. This directory contains the HT32F67595 BLE stack, application projects, and peripheral drivers.

2.Code_Ble/
├── libraries/           # BLE libraries (.a / .lib)
├── sources/             # Source code
│   ├── ble5.1/          # BLE 5.1 stack
│   ├── boards/          # Board definitions (e.g. ht32f67595_evb)
│   ├── components/      # Common components (OTA, Flash, timer, HCI, IPC, ...)
│   ├── device/          # Device support (CMSIS, startup, ...)
│   ├── drivers/         # Peripheral drivers
│   ├── mem_cfg/         # Memory configuration
│   ├── patch/           # Patches and extensions (BLE, HAL, HW)
│   └── projects_source/ # Application and example source
│       ├── application/ # Applications (CGM, GLS, HRS, HTS, PLXS, WSS, ...)
│       │   ├── cgm_LPwr/     # CGM low-power
│       │   └── cgm_profile/  # CGM protocol and GATT
│       ├── ble_examples/     # BLE peripheral / central / multi-role examples
│       └── ...
└── third_party/         # Third-party config (e.g. CMSIS Pack)

• CGM application and protocol: sources/projects_source/application/cgm_profile/, cgm_LPwr/
• BLE examples: sources/projects_source/ble_examples/ (peripheral, central, multi-role)
• Other profiles: GLS, HRS, HTS, PLXS, WSS under application/ for reference

Buildable projects are typically opened in Keil (or the IDE specified by Holtek) via the corresponding .uvprojx / project file. Refer to the delivered project list for specifics.

• Install Holtek HT32F675x5 DFP (see 1.doc/HT32F67595_开发资料/)
• Program with J-Link or e-Write32 / HOPE3200 following the programming guide in 1.doc/HT32F67595_开发资料/
• OTA updates use HOLTEK_OTA_1.2.7.apk with the instructions in HOLTEK_OTA_APP下载连接.txt

Demo board and CGM-related PCB design files for hardware reference and revisions.

Recommendation: Extract the zip and confirm schematic / PCB version before using for hardware design.

1. Read documentation

• 1.doc/CGM_BH66F2455_HT32F67595_Demo_Board使用說明-V0.1.pdf
• 1.doc/CGM_BLE协议.pdf

1. Hardware setup

• Use the Demo board or your own board (see 3.board/);
• Confirm supply platform (3.0V → BH66F2455) and battery/antenna (see 1.doc/相关器件Datasheet/).

1. AFE firmware

• Open the corresponding CGM application project under 2.Code_AFE/BH66F2455_Driver/, build with Holtek IDE, and program;
• Follow the frame format and timing in BH66F2452_55_CGM_AFE通信协议.md when integrating with BLE or host.

1. BLE firmware

• Open the CGM project under 2.Code_Ble/, install DFP and programming tools, build, and program;
• Use the CGM BLE protocol document to integrate with the APP/phone; OTA uses the APK and instructions in 1.doc.

1. Chips and components

• Refer to 1.doc/相关器件Datasheet/ and HT32F67595_开发资料/ for design and troubleshooting.

• Resource pack version: based on the BestHealth CGM BH66F2455 + HT32F67595 design as of 2026-06-08.
• AFE protocol: see version notes in 2.Code_AFE/BH66F2455_Driver/application_projects/doc/BH66F2452_55_CGM_AFE通信协议.md.
• Technical support: tony@e-besthealth.com (project contact)
• Business inquiries: info@e-besthealth.com
• Website: https://www.e-besthealth.com
• Address: Office 301, Building 10, Xinzhu Garden, No.4 Xinzhu Road, Songshan Lake, Dongguan, Guangdong, China
• Phone: +86-769-26261311

The materials in this repository — including hardware schematics, PCB files, source code, and documents — are provided solely for customer reference and evaluation. Before using these materials in product design, mass production, or commercial deployment, customers are responsible for conducting full functional testing, reliability validation, and regulatory certification. BestHealth Electronics Inc. (悠健电子（东莞）有限公司) shall not be liable for any direct or indirect losses arising from the customer's use of these materials in production, sale, or operation — including but not limited to yield issues, field failures, product recalls, or end-customer claims. These materials are provided "as is" without warranty of any kind, express or implied.

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